Patent Assignment
Reel/Frame 023264/0402
Assignment of Assignor's Interest
Recorded: 2009-09-11
Pages: 3
Assignor
KITAHARA, HIROSHI
Executed: 2009-08-17
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor integrated circuit design method for determining thickness of wiring based on plural factors contributing to thickness of wiring
Application:
12/585,339 →
Publication:
US 2010/0076580
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.