Patent Assignment
Reel/Frame 023265/0702
Assignment of Assignor's Interest
Recorded: 2009-09-22
Pages: 4
Assignors
OHNISHI, TOHRU
Executed: 2009-06-23
KOUNO, HITOSHI
Executed: 2009-06-24
TANIGUCHI, TOSHIYUKI
Executed: 2009-06-29
NAKASHIMA, KOJI
Executed: 2009-06-29
NAKATA, TOSHIYUKI
Executed: 2009-06-29
IMANISHI, TSUNETSUGU
Executed: 2009-06-29
NAKAO, KEIICHI
Executed: 2009-06-25
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Heat Dissipating Structure Base Board, Module Using Heat Dissipating Structure Base Board, and Method for Manufacturing Heat Dissipating Structure Base Board