Patent Assignment
Reel/Frame 023274/0964
Assignment of Assignor's Interest
Recorded: 2009-09-23
Pages: 2
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package-On-Package Device, Semiconductor Package and Method for Manufacturing the Same