Assignment of Assignor's Interest

Recorded: 2009-09-15 Pages: 3

Assignor

SASAKI, KOU

Executed: 2009-08-24

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor package having electrostatic protection circuit for semiconductor package including multiple semiconductor chips

Application: 12/585,446 →

Publication: US 2010/0103573

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.