IP Library › Assignment 023290/0177
Patent Assignment
Reel/Frame 023290/0177

Assignment of Assignor's Interest

Recorded: 2009-09-28 Pages: 3
Assignors
CHANDRASEKARAN, ARVIND
Executed: 2009-09-28
KIM, JONGHAE
Executed: 2009-09-28
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Semiconductor Die-Based Packaging Interconnect
Patent: 8,391,018 →
Application: 12/567,982 →
Publication: US 2011/0075393