Patent Assignment
Reel/Frame 023296/0422
Assignment of Assignor's Interest
Recorded: 2009-09-28
Pages: 4
Assignors
SHIN, CHANG-WOO
Executed: 2009-08-21
CHUNG, HYUN-SOO
Executed: 2009-08-28
AHN, EUN-CHUL
Executed: 2009-08-28
KIM, JUM-GON
Executed: 2009-08-28
CHUN, JIN-HO
Executed: 2009-08-21
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Inter Connection Structure Including Copper Pad and Pad Barrier Layer, Semiconductor Device and Electronic Apparatus Including the Same