Patent Assignment
Reel/Frame 023298/0011
Assignment of Assignor's Interest
Recorded: 2009-09-29
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMNOUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of lead cutting of a Flat Package device for proper soldering by half blanking method
Application:
12/569,085 →
Publication:
US 2010/0078803
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.