IP Library Assignment 023303/0546
Patent Assignment
Reel/Frame 023303/0546

Assignment of Assignor's Interest

Recorded: 2009-09-30 Pages: 6
Assignors
CASES, MOISES
Executed: 2009-09-29
KIM, TAE HONG
Executed: 2009-09-28
MANDREKAR, ROHAN U.
Executed: 2009-09-28
SHERALI, NUSRAT I.
Executed: 2009-09-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Through-Hole-Vias in Multi-Layer Printed Circuit Boards
Patent: 8,242,384 →
Application: 12/570,029 →
Publication: US 2011/0073359
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 034194/0291 →