Through hole-vias in multi-layer printed circuit boards

1. A multi-layer printed circuit board (‘PCB’) comprising:

layers of laminate;

at least one via hole traversing the layers of laminate, and

a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper, wherein both the used portion and the unused portion of the via conductor comprise copper and only the unused portion of the via conductor is coated with a metal having a conductivity lower than the conductivity of copper.

2. The PCB of claim 1 wherein:

the used portion of the via conductor conducts an alternating current signal from a trace on one layer of the PCB to a trace on another layer of the PCB, and

the alternating current signal is characterized by a frequency high enough to demonstrate skin effect, moving the alternating current toward the surface of the via conductor.

3. The PCB of claim 1 wherein:

the unused portion of the via conductor has no connection to any further trace,

the unused portion of the via conductor implements a resonant stub effecting an insertion loss of the alternating current signal centered on a resonant frequency, and

the metal having a conductivity lower than the conductivity of copper increases resistive dampening of resonance and reduces the insertion loss.

4. The PCB of claim 1 wherein the metal having a conductivity lower than the conductivity of copper is iron.

5. The PCB of claim 1 wherein the metal having a conductivity lower than the conductivity of copper is nickel.