Patent Assignment
Reel/Frame 023310/0516
Assignment of Assignor's Interest
Recorded: 2009-09-30
Pages: 7
Assignors
HABA, BELGACEM
Executed: 2009-08-21
RYU, CHANG MYUNG
Executed: 2009-09-17
ENDO, KIMITAKA
Executed: 2009-09-18
WADE, CHRISTOPHER PAUL
Executed: 2009-09-03
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
Application:
12/462,208 →
Publication:
US 2010/0044860
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.