IP Library › Assignment 023317/0294
Patent Assignment
Reel/Frame 023317/0294

Assignment of Assignor's Interest

Recorded: 2009-10-02 Pages: 2
Assignors
ITAYA, SATOSHI
Executed: 2009-09-28
SASAKI, DAI
Executed: 2009-09-28
KATAGIRI, MITSUAKI
Executed: 2009-09-28
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Semiconductor Device and Method of Bonding Wires Between Semiconductor Chip and Wiring Substrate
Patent: 8,378,507 →
Application: 12/572,326 →
Publication: US 2010/0084773
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →