IP Library Assignment 023325/0354
Patent Assignment
Reel/Frame 023325/0354

Assignment of Assignor's Interest

Recorded: 2009-10-05 Pages: 8
Assignors
SUN, HAIXIAO
Executed: 2007-05-07
LU, DAOQIANG
Executed: 2007-04-30
XU, AIYING
Executed: 2007-05-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Multi-Die Molded Substrate Integrated Circuit Device
Patent: 7,670,866 →
Application: 11/746,553 →
Publication: US 2008/0277781
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →