Patent Assignment
Reel/Frame 023325/0581
Assignment of Assignor's Interest
Recorded: 2009-10-05
Pages: 4
Assignor
TEIXEIRA, RICARDO COTRIN
Executed: 2009-09-25
Assignees
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
KATHOLIEKE UNIVERSITEIT LEUVEN, K.U.LEUVEN R&D
MINDERBROEDERSSTRAAT 8A, BUS 5105, LEUVEN, 3000, BELGIUM
Covered Property
(1)
Method for Reducing the Thickness of Substrates