Patent Assignment
Reel/Frame 023353/0529
Assignment of Assignor's Interest
Recorded: 2009-10-01
Pages: 2
Assignors
KOO, TAE-HYOUNG
Executed: 2009-09-23
CHOI, SAM-JONG
Executed: 2009-09-23
KIM, YEONSOOK
Executed: 2009-09-23
KIM, TAESUNG
Executed: 2009-09-23
CHO, KYOOCHUL
Executed: 2009-09-23
CHOI, JOONYOUNG
Executed: 2009-09-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Wafer, Semiconductor Device Using the Same, and Method and Apparatus for Producing the Same