Patent Assignment
Reel/Frame 023386/0619
Assignment of Assignor's Interest
Recorded: 2009-10-19
Pages: 12
Assignors
KOH, YONG CHUAN
Executed: 2009-10-15
SIAT, JIMMY
Executed: 2009-10-13
SALAMAT, JEFFREY NANTES
Executed: 2009-10-13
PEPITO, LOPE JR. VALLESPIN
Executed: 2009-10-15
CALDERON, RONALDO CAYETANO
Executed: 2009-10-13
MANALAC, RODEL
Executed: 2009-10-15
ONG, PANG HUP
Executed: 2009-10-15
ENG, KIAN TENG
Executed: 2009-10-15
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property
(1)
Copper on Organic Solderability Preservative (Osp) Interconnect and Enhanced Wire Bonding Process
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →