Patent Assignment
Reel/Frame 023391/0988
Assignment of Assignor's Interest
Recorded: 2009-10-19
Pages: 4
Assignors
CORWIN, MICHAEL
Executed: 2008-04-07
NGUYEN, DUONG
Executed: 2008-04-07
CHAMDANI, JOSEPH I
Executed: 2008-04-07
Assignee
KICKFIRE, INC.
2055 LAURELWOOD ROAD, SUITE 150, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Flexible Mechanical Packaging Form Factor for Rack Mounted Computing Devices
Application:
12/098,988 →
Publication:
US 2009/0250236
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jun 18, 2010
From: KICKFIRE, INC.
To: PINNACLE VENTURES, L.L.C.
Reel/Frame 024562/0262 →
Assignment of Assignor's Interest
Aug 14, 2010
From: KICKFIRE, INC.
To: TERADATA CORPORATION
Reel/Frame 024837/0316 →
Release of Security Interest
Aug 14, 2010
From: PINNACLE VENTURES L.L.C.
To: KICKFIRE, INC. (FORMERLY KNOWN AS C2 APPLIANCE INCORPORATED)
Reel/Frame 024837/0322 →
Corrective Assignment to Correct the Assignee's Name from Teradata Corporation to Teradata Us, Inc. Previously Recorded on Reel 024837 Frame 0316. Assignor(S) Hereby Confirms the Attached Kickfire Patent Assignment Shows Conveyance from Kickfire to Teradata Us, Inc.
Sep 22, 2010
From: KICKFIRE, INC.
To: TERADATA US, INC.
Reel/Frame 025028/0674 →