FLEXIBLE MECHANICAL PACKAGING FORM FACTOR FOR RACK MOUNTED COMPUTING DEVICES
The present invention comprises a dual-use form factor for rack mounting equipment. In particular, the form-factor is configured so that it can be both rack-mounted directly or installed within a chassis. In addition, the form-factor may comprise one or more blind-mate connector systems that are suitable for blunt-type connectors, such as PCIe connectors.
1 . A 1U module, said module comprising:
a form factor that can accommodate both rack mounting directly and mounting into a chassis; and
a blind mate connector.
2 . The 1U module of claim 1 , wherein the blind mate connector is a PCIe connector.
3 . A mounting frame system, said system comprising:
an open front-side that permits docking of at least one module and access to the at least one module; and
a back-side having a set of cabling interfaces that are configured to be blindly coupled to the at least one module, while maintaining connections of cables to the cabling interface.
4 . A modular mounting system, said system comprising:
a first section configured to hold a host system; and
a second section having a plurality of sizes that can be mated to the first section.
5 . A module, said module comprising:
a form factor that can accommodate both rack mounting directly and mounting into a chassis; and
a set of connectors that support blind mate and direct cable attachment.
6 . The module of claim 5 , wherein the module provides power to other modules via a blind mate connector that can connect to the other module.
7 . The module of claim 5 , wherein the modules comprise a communication hub for other modules to connect to a host processor.
8 . The module of claim 1 , wherein at least one of the set of connectors is a PCIe connector.
9 . The module of claim 1 , wherein at least one of the set of connectors is a combination power and signal connector.
10 . The module of claim 1 , wherein at least one of the set of connectors is a AC power connector.