Patent Assignment
Reel/Frame 023405/0961
Assignment of Assignor's Interest
Recorded: 2009-10-22
Pages: 4
Assignors
TU, HSIU-WEN
Executed: 2009-10-05
KUO, REN-LONG
Executed: 2009-10-05
SHIAO, YOUNG-HOUNG
Executed: 2009-10-05
CHEN, TSAO-PIN
Executed: 2009-10-05
HO, MON-NAM
Executed: 2009-10-05
HSU, CHIH-CHENG
Executed: 2009-10-05
LIN, CHIN-FU
Executed: 2009-10-05
HSIN, CHUNG-HSIEN
Executed: 2009-10-05
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI 302, CHU-PEI CITY, HSIN-CHU HSIEN, 302, TAIWAN
Covered Property
(1)
Manufacturing Method for Molding Image Sensor Package Structure and Image Sensor Package Structure Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.