Patent Assignment
Reel/Frame 062119/0661
Merger
Recorded: 2022-12-14
Pages: 13
Assignor
KINGPAK TECHNOLOGY INC.
Executed: 2022-08-26
Assignee
TONG HSING ELECTRONIC INDUSTRIES, LTD.
6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., TAIPEI CITY, 100011, TAIWAN
Covered Properties
(64)
Injection Molded Image Sensor and a Method for Manufacturing the Same
Patent:
6,649,834 →
Application:
10/321,917 →
Stacked Structure for an Image Sensor
Patent:
6,740,973 →
Application:
10/340,361 →
Method for Manufacturing an Image Sensor
Image Sensor and Method for Manufacturing the Same
Image Sensor Having an Improved Transparent Layer
Multiple Chips Image Sensor Package
Image Sensor Structure
Patent:
7,064,404 →
Application:
11/052,990 →
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices
Methods for Packaging Image Sensitive Electronic Devices
Image Sensor Module with a Protection Layer and a Method for Manufacturing the Same
Image Sensor Module with Air Escape Hole and a Method for Manufacturing the Same
Image Sensor Package Structure
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Image Sensor Package Structure with Casing Including a Vent Without Sealing and in Communication with Package Material
Manufacturing Method for Molding Image Sensor Package Structure and Image Sensor Package Structure Thereof
Image Sensor Package Structure with Large Air Cavity
Wafer Level Image Sensor Packaging Structure and Manufacturing Method for the Same
Image Sensor Packaging Structure with Black Encapsulant
Manufacturing Method and Structure for Wafer Level Image Sensor Module with Fixed Focal Length
Manufacturing Method of Molded Image Sensor Packaging Structure with Predetermined Focal Length and the Structure Using the Same
Wafer Level Image Sensor Packaging Structure and Manufacturing Method of the Same
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Method for Reducing Tilt of Optical Unit During Manufacture of Image Sensor
Structure and Manufacturing Method for High Resolution Camera Module
Two-Stage Packaging Method of Image Sensors
Optical Package Structure
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Package Base Core and Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Stack Type Sensor Package Structure
Method for Inspecting Sensor Package Structure, Inspection Apparatus, and Focus Assistant Loader of Inspection Apparatus
Sensor Package Structure
Sensor Package Structure
Optical Sensor
Sensor Package Structure
Chip-Scale Sensor Package Structure
Sensor Package Structure
Image Sensor Package with Particle Blocking Dam
Package Component
Patent:
10,804,413 →
Application:
16/729,842 →
Sensor Package Structure and Sensing Module Thereof
Method for Reducing Warpage Occurred to Substrate Strip After Molding Process
Patent:
10,916,511 →
Application:
16/784,299 →
Defect Inspection Method for Sensor Package Structure
Sensor Package Structure
Sensor Package Structure with Ring-Shaped Solder Mask Frame
Application:
16/920,492 →
Publication:
US 2021/0305437
Chip-Scale Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure and Manufacturing Method Thereof
Application:
17/564,142 →
Publication:
US 2023/0073527
Sensor Lens Assembly Having Non-Reflow Configuration
Sensor Lens Assembly Having Non-Soldering Configuration
Sensor Lens Assembly Having Non-Reflow Configuration
Sensor Lens Assembly Having Non-Reflow Configuration
Sensor Lens Assembly Having Non-Soldering Configuration
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Sensor Package Structure
Application:
17/741,421 →
Publication:
US 2023/0197743
Sensor Package Structure
Sensor Package Structure
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2008
From: TU, HSIU WEN; PENG, CHEN PIN; HO, MON NAN; HSIN, CHUNG HSIEN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 021415/0104 →
Assignment of Assignor's Interest
Oct 15, 2009
From: TU, HSIU-WEN; KUO, REN-LONG; SHIAO, YOUNG-HOUNG; CHEN, TSAO-PIN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 023375/0067 →
Assignment of Assignor's Interest
Oct 22, 2009
From: TU, HSIU-WEN; KUO, REN-LONG; SHIAO, YOUNG-HOUNG; CHEN, TSAO-PIN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 023405/0961 →
Assignment of Assignor's Interest
Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →
Assignment of Assignor's Interest
Jan 7, 2010
From: TU, HSIU-WEN; KUO, REN-LONG; SHIAO, YOUNG-HOUNG; CHEN, TSAO-PIN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 023746/0406 →
Assignment of Assignor's Interest
Nov 16, 2010
From: TU, HSIU-WEN; CHEN, HAN-HSING; HSIN, CHUNG-HSIEN; CHEN, MING-HUI
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 025368/0102 →
Assignment of Assignor's Interest
May 24, 2019
From: ROUND ROCK RESEARCH, LLC
To: SUPERMAX TECHNOLOGY L.T.D.
Reel/Frame 049281/0178 →
Assignment of Assignor's Interest
May 28, 2019
From: SUPERMAX TECHNOLOGY L.T.D
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 049292/0574 →
Assignment of Assignor's Interest
Apr 7, 2022
From: LEE, CHIEN-CHEN; HUNG, LI-CHUN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 059537/0584 →