Image sensor and method for manufacturing the same
View Patent ↗An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip. And a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.
1. An image sensor to be mounted to a printed circuit board, the image sensor comprising:
a substrate having an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points, which is electrically connect to the printed circuit board;
a photosensitive chip mounted to the upper surface of the substrate;
a plurality of wires for electrically connecting the photosensitive chip to the first connection points on the upper surface of the substrate; and
a frame layer mounted to the upper surface of the substrate to surround the photosensitive chip, and a transparent layer being fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.
2. The image sensor according to claim 1 , wherein the frame layer is made of industrial plastic material by way of injection molding to encapsulate the transparent layer.
3. The image sensor according to claim 1 , wherein the transparent layer is a piece of transparent glass.
4. A method for manufacturing an image sensor, comprising the steps of:
providing a substrate having an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points, which is electrically connect to the printed circuit board;
mounting a photosensitive chip to the upper surface of the substrate;
providing a plurality of wires for electrically connecting the photosensitive chip to the first connection points on the upper surface of the substrate; and
mounting a frame layer to the upper surface of the substrate so as to surround the photosensitive chip, and a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.
5. The method according to claim 4 , wherein the frame layer is made of industrial plastic material by way of injection molding to encapsulate the transparent layer.
6. The method according to claim 4 , wherein the transparent layer is a piece of transparent glass.