Multiple chips image sensor package
View Patent ↗A multi-chip image sensor module includes a first substrate; a photosensitive chip arranged on an upper surface of the first substrate; a lens holder mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel arranged within the lens holder and formed with a chamber and an opening communicating with the chamber; an aspheric lens and a transparent layer placed within the chamber; a second substrate mounted on the first substrate and electrically connected to the first substrate; and a lower chip located on a second surface of the second substrate.
1. A multi-chip image sensor module, comprising:
a first substrate, which has an upper surface and a lower surface, wherein the upper surface is formed with a plurality of first connecting ends, and the lower surface is formed with a plurality of second connecting ends;
a photosensitive chip, which is arranged on the upper surface of the first substrate, and electrically connected to the first connecting ends by a plurality of first wires;
a lens holder formed with a through hole at a center thereof, wherein an internal thread is formed on an inner wall of the through hole, and the lens holder is mounted on the upper surface of the first substrate to encapsulate the photosensitive chip;
a lens barrel arranged within the through hole of the lens holder and formed with an external thread, which is screwed to the internal thread of the lens holder, wherein the lens barrel is formed with a chamber and an opening communicating with the chamber;
an aspheric lens and a transparent layer placed within the chamber;
a second substrate having a first surface on which a plurality of signal output ends are formed, and a second surface on which a plurality of signal input ends are formed, wherein the first surface of the second substrate is mounted on the lower surface of the first substrate, and then the signal output ends are electrically connected the second connecting ends of the first substrate; and
a lower chip located on the second surface of the second substrate and electrically connected to the signal input ends of the second substrate.
2. The multi-chip image sensor module according to claim 1 , wherein the second substrate is a flexible/hard combination board, which includes a flexible board and a hard board, the lower chip is mounted on the flexible board, and the hard board is mounted on the lower surface of the first substrate.
3. The multi-chip image sensor module according to claim 1 , wherein the lower chip is electrically connected to the signal input ends by second wires.
4. The multi-chip image sensor module according to claim 1 , further comprising a resin layer for encapsulating the lower chip.
5. The multi-chip image sensor module according to claim 1 , wherein the lower chip is a signal processor and the image sensor module further comprises a resin layer for encapsulating the lower chip.