Assignment of Assignor's Interest

Recorded: 2003-11-10 Pages: 2

Assignors

WU, JICHEN

Executed: 2003-09-03

HSIEH, FIGO

Executed: 2003-09-05

Assignee

KINGPAK TECHNOLOGY INC.

NO. 84, TAIHO RD. CHUPEI, HSINCHU HSIEN, R.O.C., TAIWAN

Covered Property (1)

Multiple Chips Image Sensor Package

Patent: 7,345,360 →

Application: 10/705,379 →

Publication: US 2005/0099531

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.