Patent Assignment
Reel/Frame 049292/0574
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 16
Assignor
SUPERMAX TECHNOLOGY L.T.D
Executed: 2019-04-22
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO ROAD, CHU-PEI, HSINCHU HSIEN, 302, TAIWAN
Covered Properties
(6)
Methods for Packaging Image Sensitive Electronic Devices
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices
Methods for Packaging Image Sensitive Electronic Devices
Methods for Packaging Image Sensitive Electronic Devices
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →
Assignment of Assignor's Interest
Oct 28, 2011
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 027331/0424 →
Assignment of Assignor's Interest
May 15, 2013
From: BOLKEN, TODD O.; COBBLEY, CHAD A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030417/0231 →
Assignment of Assignor's Interest
May 24, 2019
From: ROUND ROCK RESEARCH, LLC
To: SUPERMAX TECHNOLOGY L.T.D.
Reel/Frame 049281/0178 →
Merger
Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →