Patent Assignment
Reel/Frame 030417/0231
Assignment of Assignor's Interest
Recorded: 2013-05-15
Pages: 4
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83706
Covered Property
(1)
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 28, 2011
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 027331/0424 →
Assignment of Assignor's Interest
May 24, 2019
From: ROUND ROCK RESEARCH, LLC
To: SUPERMAX TECHNOLOGY L.T.D.
Reel/Frame 049281/0178 →
Assignment of Assignor's Interest
May 28, 2019
From: SUPERMAX TECHNOLOGY L.T.D
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 049292/0574 →
Merger
Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →