IP Library › Assignment 027331/0424
Patent Assignment
Reel/Frame 027331/0424

Assignment of Assignor's Interest

Recorded: 2011-10-28 Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2009-12-30
Assignee
ROUND ROCK RESEARCH, LLC
P. O. BOX 1042, MOUNT KISCO, NEW YORK, 10549
Covered Property (1)
Methods of Fabrication of Package Assemblies for Optically Interactive Electronic Devices and Package Assemblies Therefor
Patent: 8,426,954 →
Application: 13/212,579 →
Publication: US 2011/0298077
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 15, 2013
From: BOLKEN, TODD O.; COBBLEY, CHAD A.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030417/0231 →
Assignment of Assignor's Interest May 24, 2019
From: ROUND ROCK RESEARCH, LLC
To: SUPERMAX TECHNOLOGY L.T.D.
Reel/Frame 049281/0178 →
Assignment of Assignor's Interest May 28, 2019
From: SUPERMAX TECHNOLOGY L.T.D
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 049292/0574 →
Merger Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →