IP Library Granted Patent US 7,064,404
Granted Patent B1
US 7,064,404 · App. 11/052,990 · Granted Jun 20, 2006

Image sensor structure

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Quick Facts
Patent No.
US 7,064,404
App. No.
11/052,990
Granted
Jun 20, 2006
Kind
B1
Abstract

An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.

Claims (10)

1. An image sensor structure, the structure comprising:

a substrate having an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed;

four posts arranged on the four angle of the upper surface of the substrate individually;

a photosensitive chip mounted on the upper surface of the substrate;

a plurality of wires electrically connected the photosensitive chip to the first electrodes of the substrate;

a glue layer surrounded on the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires; and

a transparent layer arranged onto the four posts and the glue layer to cover the photosensitive chip.

2. The image sensor structure according to claim 1 , wherein the periphery of the substrate is formed with conductive material for electrically connecting the first electrodes to corresponding to the second electrodes of the substrate.

3. The image sensor structure according to claim 2 , wherein the transparent layer is transparent glass.

4. The image sensor structure according to claim 1 , wherein the transparent layer is adhered to the four posts by the glue layer.

Assignments (2)
MERGER Recorded Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2005
From: HSIN, CHUNG HSIEN; WANG, TONY; TSAI, WORRELL; HSIEH, FIGO; CHANG, WEI; YEN, JUN JIE
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 016484/0901 →