IP Library Granted Patent US 10,804,413
Granted Patent B1
US 10,804,413 · App. 16/729,842 · Granted Oct 13, 2020

Package component

Inventor: Yu-Hsuan Tsai (Hsinchu County, TW)
Assignee: KINGPAK TECHNOLOGY INC
H01L31/0203B29C35/0805C09D5/006B29C2035/0827
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Quick Facts
Patent No.
US 10,804,413
App. No.
16/729,842
Granted
Oct 13, 2020
Kind
B1
Abstract

A package component includes a base layer, a sensing layer, a photo-curable adhesive, a cover layer and a first filter structure. The photo-curable adhesive and the sensing layer are disposed on the base layer. The sensing layer includes a sensing unit surrounded by the photo-curable adhesive. The cover layer is disposed on the sensing layer. The first filter structure faces the photo-curable adhesive and is disposed on the cover layer. The first filter structure is configured for transmitting a curing light which is used to cure the photo-curable adhesive, and for reflecting a detectable light which is to be sensed by the sensing unit, where the wavelength of the curing light is different from the wavelength of the detectable light.

Claims (15)

1. A package component, comprising:

a base layer;

a photo-curable adhesive, disposed on the base layer;

a sensing layer, disposed on the base layer, the sensing layer comprising a sensing unit surrounded by the photo-curable adhesive;

a cover layer, disposed above the sensing layer and hermetically connected to the base layer through the photo-curable adhesive;

a first filter structure, corresponding to the photo-curable adhesive, and disposed on a surface of the cover layer, the first filter structure being configured for transmitting a curing light which is used to cure the photo-curable adhesive, and for reflecting a detectable light which is to be sensed by the sensing unit, wherein a wavelength of the curing light is different from a wavelength of the detectable light; and

a second filter structure, corresponding to the sensing unit, and disposed on a surface of the cover layer, the second filter structure being configured for transmitting the detectable light and for reflecting the curing light.

2. The package component according to claim 1 , wherein the photo-curable adhesive is an ultraviolet-curable adhesive, and the curing light is an ultraviolet light.

3. The package component according to claim 1 , wherein a transmittance of the curing light relative to the first filter structure is greater than 90%.

4. The package component according to claim 1 , wherein a reflectance of the detectable light relative to the first filter structure is greater than 90%.

5. The package component according to claim 1 , wherein the detectable light is a visible light.

6. The package component according to claim 1 , wherein the second filter structure is surrounded by the first filter structure.

7. The package component according to claim 1 , wherein an orthogonal projection of the second filter structure does not overlap with an orthogonal projection of the first filter structure.

8. The package component according to claim 1 , wherein the second filter structure is a broad-band anti-reflective (BBAR) coating, a near-infrared anti-reflective coating (NIR ARC) or a band pass filter.

9. The package component according to claim 1 , wherein the cover layer is a glass substrate.

Assignments (2)
MERGER Recorded Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2019
From: TSAI, YU-HSUAN
To: KINGPAK TECHNOLOGY INC.
Reel/Frame 051385/0501 →
Priority Claims (1)
TW 108128158 A · Aug 7, 2019 · national