IP Library Assignment 023746/0406
Patent Assignment
Reel/Frame 023746/0406

Assignment of Assignor's Interest

Recorded: 2010-01-07 Pages: 4
Assignors
TU, HSIU-WEN
Executed: 2009-10-27
KUO, REN-LONG
Executed: 2009-10-27
SHIAO, YOUNG-HOUNG
Executed: 2009-10-27
CHEN, TSAO-PIN
Executed: 2009-10-27
HO, MON-NAM
Executed: 2009-10-27
HSU, CHIH-CHENG
Executed: 2009-10-27
LIN, CHIN-FU
Executed: 2009-10-27
HSIN, CHUNG-HSIEN
Executed: 2009-10-27
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI, HSIN-CHU HSIEN, 302, TAIWAN
Covered Property (1)
Image Sensor Package Structure with Large Air Cavity
Patent: 8,390,087 →
Application: 12/683,546 →
Publication: US 2011/0024862
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 14, 2022
From: KINGPAK TECHNOLOGY INC.
To: TONG HSING ELECTRONIC INDUSTRIES, LTD.
Reel/Frame 062119/0661 →