Image sensor package structure
View Patent ↗An image sensor package structure includes a plastic substrate, frame layer, a chip, wires, a transparent layer, and an encapsulate layer. The plastic substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes. The frame layer is arranged on the upper surface of the plastic substrate, a cavity is formed between the plastic substrate and the frame layer. The chip is mounted on the upper surface of the plastic substrate, and is located within the cavity. The plurality of wires are electrically connected the chip to the first electrodes of the plastic substrate. The transparent layer is mounted on the frame layer to cover the chip. And the encapsulate layer is encapsulated the frame layer, and is covered on the periphery the transparent layer.
1. An image sensor package structure, the package structure comprising:
a plastic substrate having an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes;
a frame layer arranged on the upper surface of the plastic substrate, and having a cavity is formed between the plastic substrate and the frame layer;
a chip mounted on the upper surface of the plastic substrate, and located within the cavity;
a plurality of wires electically connecting the chip to the first electrodes of the plastic substrate;
a transparent layer mounted on the frame layer to cover the chip; and
an encapsulate layer formed to encapsulate an outer portion of the frame layer, and an outer periphery of the transparent layer.
2. The image sensor package structure according to claim 1 , wherein each of the second electrodes of the plastic susbtrate is formed to have a metallic ball thereon.
3. The image sensor package structure according to claim 1 , wherein the encapsulate layer is formed of epoxy.