Image sensor module with a protection layer and a method for manufacturing the same
View Patent ↗An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
1. An image sensor module with a protection layer, comprising:
a substrate having an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes;
a chip mounted on the upper surface of the substrate, the chip having a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip;
a plurality of wires electrically connected the bonding pads of the chip to the first electrodes of the substrate;
an adhered layer coated on the upper surface of the substrate;
a lens holder having a lateral wall, the protection layer an internal thread, the lateral side of the lens holder adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on between the sensor region of the chip and the adhered layer to prevent the adhered layer flowed to the sensor region of the chip; and
a lens barrel formed with an external thread screwed on the internal thread of the lens holder.
2. The image sensor module structure according to claim 1 , wherein the upper surface of the substrate is formed with a frame layer, the adhered layer is coated between the frame layer and the chip, so that the lateral wall of the lens holder is adhered between the frame layer and the chip, and cutting the lateral wall of the lens holder and the substrate to form a module.