Image sensor having an improved transparent layer
View Patent ↗An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut—corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.
1. An image sensor to be electrically connected to a printed circuit board, comprising:
a substrate having an upper surface formed with a plurality of first connected points projecting over the upper surface and a lower surface;
a frame layer being arranged on the upper surface of the substrate so as to form a cavity together with the substrate;
a photosensitive chip being formed with a plurality of bonding pads and being mounted on the upper surface of the substrate and within the cavity;
a plurality of wires, each wire electrically connected the bonding pad of the photosensitive chip to the first connected point of the substrate; and
a transparent layer covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer respectively, at the periphery of the transparent layer formed with cut—corner.
2. The image sensor according to claim 1 , wherein the lower surface of the substrate has a plurality of second connected points for connecting the printed circuit board.
3. The image sensor according to claim 1 , wherein the transparent layer is a piece of transparent glass.
4. The image sensor according to claim 1 , wherein the cut-corner of the transparent layer is a spherical-shaped.
5. The image sensor according to claim 1 , wherein the cut-corner of the transparent layer is an incline-shaped.