Patent Assignment
Reel/Frame 025368/0102
Assignment of Assignor's Interest
Recorded: 2010-11-16
Pages: 3
Assignors
TU, HSIU-WEN
Executed: 2010-07-06
CHEN, HAN-HSING
Executed: 2010-07-06
HSIN, CHUNG-HSIEN
Executed: 2010-07-06
CHEN, MING-HUI
Executed: 2010-07-06
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI, HSIN-CHU HSIEN, 30267, TAIWAN
Covered Property
(1)
Wafer Level Image Sensor Packaging Structure and Manufacturing Method for the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.