Image sensor module with air escape hole and a method for manufacturing the same
View Patent ↗An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.
1. An image sensor module with air escape hole, the module comprising:
a substrate having an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes;
a chip mounted on the upper surface of the substrate, the chip having a sensor region and a plurality of bonding pads located at the side of the sensor region;
a plurality of wires electrically connected the bonding pads of the chip to the first electrodes of the substrate;
an adhesive layer coated on the upper surface of the substrate;
a lens holder mounted on the upper surface of the substrate by the adhesive layer, and formed with a top wall, a lateral wall, and an internal thread, the top wall formed with an air escape hole;
a lens barrel formed with an external thread screwed on the internal thread of the lens holder; and
a filled glue filled within the air escape hole of the lens holder.
2. The image sensor module with air escape hole according to claim 1 , wherein the filled glue is formed of epoxy.
3. The image sensor module with air escape hole according to claim 1 , wherein the outer surface of the lateral wall of the lens holder and of the substrate adhered on the lateral wall of the lens holder have cut surfaces in the same plane.
4. A method for manufacturing the image sensor module with air escape hole, comprising the steps of:
providing a substrate having an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes;
mounting a chip on the upper surface of the substrate, the chip having a sensor region and a plurality of bonding pads located at the side of the sensor region;
electrically connecting a plurality of wires to the bonding pads of the chip and the first electrodes of the substrate;
coating an adhesive layer on the upper surface of the substrate;
mounting a lens holder, which forms with a top wall, a lateral wall and an internal thread, on the upper surface of the substrate by the adhesive layer, and forming an air escape hole through the top wall;
screwing a lens barrel formed with an external thread on the internal thread of the lens holder; and
filling a filled glue within the air escape hole of the lens holder.
5. The method according to claim 4 , wherein the filled glue is formed of epoxy.
6. The method according to claim 4 , further comprising cutting outer portions of the lateral wall of the lens holder and of the substrate adhered on the lateral wall of the lens holder.
7. An image sensor module with air escape hole, the module comprising:
a substrate having an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes;
a chip mounted on the upper surface of the substrate, the chip having a sensor region and a plurality of bonding pads located at the side of the sensor region;
a plurality of wires electrically connected the bonding pads of the chip to the first electrodes of the substrate;
an adhesive layer coated on the upper surface of the substrate;
a lens holder mounted on the upper surface of the substrate by the adhesive layer, and formed with a top wall, a lateral wall, and an internal thread; and
a lens barrel formed with an external thread screwed on the internal thread of the lens holder,
characterized in that an air escape hole is formed through the top wall, and a filled glue is filled within the air escape hole of the lens holder.
8. The image sensor module with air escape hole according to claim 7 , wherein the filled glue is formed of epoxy.
9. The image sensor module with air escape hole according to claim 7 , wherein the outer surface of the lateral wall of the lens holder and of the substrate adhered on the lateral wall of the lens holder have cut surfaces in the same plane.