Sensor package structure
A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer being ring-shaped and disposed on an inner surface of the light-permeable layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. A portion of the shielding layer in contact with the light-curing layer defines a ring-shaped arrangement region that has at last one light-permeable slot. The sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.
1. A sensor package structure, comprising:
a substrate;
a sensor chip disposed on the substrate along a predetermined direction and electrically coupled to the substrate, wherein the sensor chip has a sensing region arranged on a top surface thereof;
a light-curing layer being ring-shaped, wherein the light-curing layer is disposed on the top surface of the sensor chip and surrounds the sensing region;
a light-permeable layer having an outer surface and an inner surface that is opposite to the outer surface, wherein the inner surface of the light-permeable layer is disposed on the light-curing layer, and the light-permeable layer is arranged above the sensor chip, and wherein the inner surface of the light-permeable layer, the light-curing layer, and the top surface of the sensor chip jointly define an enclosed space;
a shielding layer being ring-shaped and disposed on the inner surface of the light-permeable layer, wherein a projection region defined by orthogonally projecting the shielding layer onto the top surface along the predetermined direction surrounds the sensing region, and wherein a portion of the shielding layer in contact with the light-curing layer defines a ring-shaped arrangement region, and the ring-shaped arrangement region of the shielding layer has at last one light-permeable slot; and
a package body formed on the substrate, wherein the sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body, and wherein the outer surface of the light-permeable layer is at least partially exposed from the package body.
2. The sensor package structure according to claim 1 , wherein the ring-shaped arrangement region is spaced apart from an inner edge of the shielding layer by a distance within a range from 90 μm to 110 μm, and the ring-shaped arrangement region is spaced apart from an outer edge of the shielding layer by a distance within a range from 90 μm to 110 μm.
3. The sensor package structure according to claim 1 , wherein the ring-shaped arrangement region is spaced apart from an inner edge of the light-curing layer by a distance within a range from 45 μm to 55 μm, and the ring-shaped arrangement region is spaced apart from an outer edge of the light-curing layer by a distance within a range from 45 μm to 55 μm.
4. The sensor package structure according to claim 1 , wherein a width of the ring-shaped arrangement region is within a range from 25% to 100% of a distance between an inner edge and an outer edge of the light-curing layer.
5. The sensor package structure according to claim 1 , wherein the at least one light-permeable slot is ring-shaped and is arranged to occupy 25% to 100% of the ring-shaped arrangement region.
6. The sensor package structure according to claim 5 , wherein a quantity of the at least one light-permeable slot is only one, and the light-permeable slot is arranged to occupy 100% of the ring-shaped arrangement region.
7. The sensor package structure according to claim 5 , wherein a quantity of the at least one light-permeable slot is more than one, and the light-permeable slots are arranged to occupy 25% to 100% of the ring-shaped arrangement region.
8. The sensor package structure according to claim 1 , wherein the at least one light-permeable slot is C-shaped and is arranged to occupy 25% to 95% of the ring-shaped arrangement region.
9. The sensor package structure according to claim 1 , wherein the sensor chip has a square shape or a rectangular shape, and a quantity of the at least one light-permeable slot is more than one, and wherein each of the light-permeable slots has a strip shape, and the light-permeable slots respectively correspond in position to edges of the sensor chip.
10. The sensor package structure according to claim 9 , wherein each of the edges of the sensor chip corresponds in position to and is parallel to one of the light-permeable slots, and the light-permeable slots are arranged to occupy 25% to 100% of the ring-shaped arrangement region.
11. The sensor package structure according to claim 9 , wherein each of the edges of the sensor chip corresponds in position to and is perpendicular to at least two of the light-permeable slots, and the light-permeable slots are arranged to occupy 25% to 100% of the ring-shaped arrangement region.
12. A sensor package structure, comprising:
a substrate;
a sensor chip disposed on the substrate along a predetermined direction and electrically coupled to the substrate, wherein the sensor chip has a square shape or a rectangular shape, and the sensor chip has a sensing region arranged on a top surface thereof;
a light-curing layer being ring-shaped, wherein the light-curing layer is disposed on the top surface of the sensor chip and surrounds the sensing region;
a light-permeable layer having an outer surface and an inner surface that is opposite to the outer surface, wherein the inner surface of the light-permeable layer is disposed on the light-curing layer, and the light-permeable layer is arranged above the sensor chip, and wherein the inner surface of the light-permeable layer, the light-curing layer, and the top surface of the sensor chip jointly define an enclosed space;
a shielding layer disposed on the inner surface of the light-permeable layer and including a plurality of shielding strips spaced apart from each other, wherein any two of the shielding strips adjacent to each other are spaced apart from each other by a region that corresponds in position to a corner of the sensor chip, and each of the shielding strips has at least one light-permeable slot, and wherein a projection region defined by orthogonally projecting the shielding layer onto the top surface along the predetermined direction surrounds the sensing region; and
a package body formed on the substrate, wherein the sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body, and wherein the outer surface of the light-permeable layer is at least partially exposed from the package body.
13. The sensor package structure according to claim 12 , wherein each of edges of the sensor chip corresponds in position to and is parallel to one of the shielding strips, and at least 25% of each of the shielding strips forms the at least one light-permeable slot.
14. The sensor package structure according to claim 12 , wherein, in each of the shielding strips, the at least one light-permeable slot is spaced apart from an inner edge of the light-curing layer by a distance within a range from 45 μm to 55 μm, and the at least one light-permeable slot is spaced apart from an outer edge of the light-curing layer by a distance within a range from 45 μm to 55 μm.
15. The sensor package structure according to claim 12 , wherein, in each of the shielding strips, a width of the at least one light-permeable slot is within a range from 25% to 100% of a distance between an inner edge and an outer edge of the light-curing layer.
16. The sensor package structure according to claim 12 , wherein the at least one light-permeable slot has a strip shape and penetrates along a longitudinal direction of a corresponding one of the shielding strips.
17. The sensor package structure according to claim 16 , wherein, in each of the shielding strips, a quantity of the at least one light-permeable slot is more than one, and the light-permeable slots are parallel to each other.
18. The sensor package structure according to claim 12 , wherein, the at least one light-permeable slot is arranged adjacent to an end of a corresponding one of the shielding strips.
19. The sensor package structure according to claim 12 , wherein, in each of the shielding strips, a quantity of the at least one light-permeable slot is more than one, and wherein each of the light-permeable slots has a strip shape and penetrates along a width direction of a corresponding one of the shielding strips.
20. The sensor package structure according to claim 19 , wherein each of the edges of the sensor chip corresponds in position to and is perpendicular to at least two of the light-permeable slots.