Patent Assignment
Reel/Frame 023410/0216
Assignment of Assignor's Interest
Recorded: 2009-10-14
Pages: 3
Assignor
TAKEDA, KUNIHIRO
Executed: 2009-10-05
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
A Semiconductor Device with Varying Bump Density Regions and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.