IP Library › Assignment 023411/0009
Patent Assignment
Reel/Frame 023411/0009

Assignment of Assignor's Interest

Recorded: 2009-10-22 Pages: 3
Assignors
KONO, TSUTOMU
Executed: 2009-10-15
MINO, MASAYUKI
Executed: 2009-10-15
TAKESHIMA, HIDEHIRO
Executed: 2009-10-15
ITO, YOUKOU
Executed: 2009-10-15
GOI, TOMOKO
Executed: 2009-10-15
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Method of Analyzing Thermal Stress According to Filling Factor of Filler in Resin
Patent: 8,215,829 →
Application: 12/604,009 →
Publication: US 2010/0103977
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →