IP Library Assignment 023415/0262
Patent Assignment
Reel/Frame 023415/0262

Assignment of Assignor's Interest

Recorded: 2009-10-23 Pages: 2
Assignor
HIRAI, NOBUKAZU
Executed: 2009-09-15
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Resin Composition and Resin Molded Product
Patent: 8,524,830 →
Application: 12/571,625 →
Publication: US 2010/0081766
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 23, 2009
From: SATO, NORITAKA; NOGUCHI, TSUTOMU
To: SONY CORPORATION
Reel/Frame 023415/0364 →
Assignment of Assignor's Interest Dec 14, 2016
From: SONY CORPORATION
To: LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
Reel/Frame 040733/0448 →