IP Library › Assignment 023440/0255
Patent Assignment
Reel/Frame 023440/0255

Assignment of Assignor's Interest

Recorded: 2009-10-27 Pages: 2
Assignors
OHUCHI, SHINJI
Executed: 2000-12-06
TANAKA, YASUO
Executed: 2000-12-06
Assignee
OKI SEMICONDUCTOR CO., LTD.
2-4-8 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA 222-8575, JAPAN
Covered Property (1)
Resin for Sealing Semiconductor Device, Resin-Sealed Semiconductor Device and the Method of Manufacturing the Semiconductor Device
Patent: 7,704,801 →
Application: 12/007,874 →
Publication: US 2008/0124843
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 5, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022399/0969 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →