Patent Assignment
Reel/Frame 023443/0752
Assignment of Assignor's Interest
Recorded: 2009-10-29
Pages: 2
Assignors
SUNOHARA, MASAHIRO
Executed: 2009-09-28
SAKAGUCHI, HIDEAKI
Executed: 2009-09-28
SHIMIZU, HIROSHI
Executed: 2009-09-28
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI,, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Electronic Component Built-in Substrate and Method of Manufacturing the Same