Patent Assignment
Reel/Frame 023467/0389
Assignment of Assignor's Interest
Recorded: 2009-11-04
Pages: 2
Assignor
CHO, YUN-RAE
Executed: 2009-10-09
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-Level Chip-on-Chip Package, Package on Package, and Methods of Manufacturing the Same