Assignment of Assignor's Interest

Recorded: 2009-11-04 Pages: 5

Assignors

CHU, LIH-LONG

Executed: 2009-09-02

NAUMOVITZ, JOHN

Executed: 2009-09-15

NICKEL, NICHOLE E.

Executed: 2009-10-08

Assignee

DOW GLOBAL TECHNOLOGIES INC.

2040 DOW CENTER, MIDLAND, MICHIGAN, 48674

Covered Property (1)

Co-Extruded, Multilayered Polyolefin-Based Backsheet for Electronic Device Modules

Patent: 8,431,235 →

Application: 12/612,169 →

Publication: US 2010/0108128

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.