Co-extruded, multilayered polyolefin-based backsheet for electronic device modules

1. A multilayer structure each layer of which having opposing facial surfaces, the structure comprising (A) a top layer comprising a maleic anhydride modified (MAH-m) polyolefin (MAH-m-polyolefin) or a blend of a polyolefin and a MAH-m-polyolefin and having a top facial surface and a bottom facial surface, (B) a first tie layer comprising an amine-functionized polyolefin or a copolymer of an ethylene with a glycidal ester of an unsaturated carboxylic acid and an optional third monomer, the tie layer adhesive and having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C. and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the first tie layer.

2. The multilayer structure of claim 1 further comprising a second tie layer having top and bottom facial surfaces, the second tie layer comprising an adhesive different than the adhesive of the first tie layer, the adhesive comprises an amine-functionalized polyolefin or a copolymer of an ethylene with a glycidyl ester of an α,β-unsaturated acid and an optional third comonomer.

3. A multilayer structure without a tie layer, the top layer comprises two sublayers, each sublayer having opposing facial surfaces, the first or top sublayer comprising (i) an ethylene copolymer, (ii) a MAH-m-ethylene copolymer, (iii) a propylene copolymer, (iv) a MAH-m-propylene copolymer, or (v) a blend of two or more of (i)-(iv), the first or top facial surface of which is in adhering contact with an encapsulant or the back surface of an electronic device (ED), and a second or bottom sublayer comprising an ethylene copolymer or a MAH-m-ethylene copolymer, with the proviso that the top and bottom sublayers are not compositionally the same, the first or top facial surface of which is in adhering contact with the second or bottom surface of the top sublayer.

4. A multilayer structure that does not contain a tie layer, the backsheet comprising a first or top layer that comprises two sublayers, (a) a first or top sublayer comprising (i) EVA, (ii) MAH-m-EVA, (iii) a blend of EVA and polyethylene, (iv) a blend of MAR-m-EVA and polyethylene, (v) a propylene copolymer, or (vi) a MAH-m-propylene copolymer, and (b) a second or bottom sublayer comprising EVA or MAH-m-EVA.

5. An ED module comprising the multilayer structure of claim 3 .

6. An electronic device (ED) module comprising a multilayer structure each layer of which having opposing facial surfaces, the structure comprising (A) a top layer comprising a maleic anhydride modified (MAH-m) polyolefin (MAH-m-polyolefin) or a blend of a polyolefin and a MAH-m-polyolefin and having a top facial surface and a bottom facial surface, (B) a first tie layer comprising an amine-functionized polyolefin or a copolymer of an ethylene with a glycidal ester of an unsaturated carboxylic acid and an optional third monomer, the tie layer adhesive and having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C. and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the first tie layer, the electronic device is in the form of a photovoltaic cell, a liquid crystal panel, an electro-luminescent device, or a plasma display unit.

7. The ED module of claim 6 in which the electronic device is a photovoltaic cell.