Patent Assignment
Reel/Frame 023470/0655
Assignment of Assignor's Interest
Recorded: 2009-11-04
Pages: 3
Assignor
HUNG, CHING-WEI
Executed: 2009-10-21
Assignee
POWERTECH TECHNOLOGY INC.
NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU SHIANG, HSINCHU, TAIWAN
Covered Property
(1)
Substrate and Package with Micro Bga Configuration