Patent Assignment
Reel/Frame 023491/0942
Assignment of Assignor's Interest
Recorded: 2009-11-09
Pages: 3
Assignor
KANG, CHUN S.
Executed: 2009-10-27
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, 467-701, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Wiring Structure of a Semiconductor Device and Method for Manufacturing Same