Patent Assignment
Reel/Frame 023514/0296
Assignment of Assignor's Interest
Recorded: 2009-11-13
Pages: 3
Assignor
TAKAHASHI, KOUHEI
Executed: 2009-11-05
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Chip Package Having a Semiconductor Element Solder Bonded to a Wiring Board with a Divisional Ridge There Between.
Application:
12/617,106 →
Publication:
US 2010/0123231
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.