Patent Assignment
Reel/Frame 023526/0744
Assignment of Assignor's Interest
Recorded: 2009-11-17
Pages: 4
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
CENTER FOR UNIVERSITY-INDUSTRY CORPORATION
307 GAJEON-RI BYEONGCHEON-MYEON CHEONAN CITY, CHUNGNAM, PROVINCE, 330-708, KOREA, REPUBLIC OF
Covered Property
(1)
Contact-Force Sensor Package and Method of Fabricating the Same