IP Library Assignment 023529/0008
Patent Assignment
Reel/Frame 023529/0008

Assignment of Assignor's Interest

Recorded: 2009-11-17 Pages: 7
Assignors
KIM, TAE HONG
Executed: 2009-10-28
SPROGIS, EDMUND J.
Executed: 2009-10-29
MCALLISTER, MICHAEL F.
Executed: 2009-10-29
SHAPIRO, MICHAEL J.
Executed: 2009-10-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Integrated Decoupling Capacitor Employing Conductive Through-Substrate Vias
Patent: 8,558,345 →
Application: 12/614,883 →
Publication: US 2011/0108948
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →