Patent Assignment
Reel/Frame 023532/0192
Assignment of Assignor's Interest
Recorded: 2009-11-17
Pages: 4
Assignors
KANG, JOON SEOK
Executed: 2009-09-29
KIM, YOUNG HO
Executed: 2009-09-29
KWEON, YOUNG DO
Executed: 2009-09-30
KIM, JIN GU
Executed: 2009-09-29
YI, SUNG
Executed: 2009-09-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Die Package and Method of Manufacturing the Same