Patent Assignment
Reel/Frame 023536/0739
Assignment of Assignor's Interest
Recorded: 2009-11-18
Pages: 6
Assignors
RADOJCIC, RATIBOR
Executed: 2009-10-06
CHANDRASEKARAN, ARVIND
Executed: 2009-10-01
LANE, RYAN
Executed: 2009-10-01
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Hybrid Package Construction with Wire Bond and Through Silicon Vias