Patent Assignment
Reel/Frame 023539/0273
Assignment of Assignor's Interest
Recorded: 2009-11-12
Pages: 3
Assignor
MUN, CHEAR-YEON
Executed: 2009-11-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Bonding Pads and Semiconductor Package Including the Semiconductor Device